Here’s the English translation: Jingyihuang Class 100 Clean Oven: Building a Drying Barrier for PCB Circuit Boards
Date：2026/4/25 11:03:08
In the field of precision electronics manufacturing, the Shenzhen Jingyihuang clean oven builds a reliable quality barrier for PCB circuit board production through multiple technological innovations. Its core value is first reflected in its ability to perform baking operations in a Class 100 clean environment. Equipped with a HEPA high-efficiency filtration system, it limits the concentration of particles larger than 0.3μm to ≤100 particles per cubic foot, effectively preventing issues such as poor solder pad wetting or circuit shorts caused by dust adhesion in traditional ovens. Second, the fully stainless steel chamber combined with ion air curtain technology maintains a positive pressure dust-proof state even at an operating temperature of 150°C, reducing the risk of coating oxidation by 92% compared to conventional ovens. The third major advantage is its precise temperature control system. Through the integration of a PID algorithm and an infrared temperature probe, the Shenzhen Jingyihuang clean oven achieves zone temperature difference control of ±0.5°C during the multilayer board curing stage, ensuring the stability of the glass transition temperature (Tg) of the FR-4 substrate and compressing the dielectric constant fluctuation range of high-frequency circuit boards to ±2%. Particularly in the production of 5G antenna modules, the clean oven's vertical circulating airflow design achieves a uniformity of 95% for the hot air flow rate between boards, successfully solving the problem of uneven local resin polymerization caused by airflow dead zones in traditional equipment. Finally, the modular design of the clean oven allows rapid switching to nitrogen protection mode, reducing the oxygen content in the immersion gold process to below 10 ppm and increasing gold layer adhesion strength to over 8 N/mm. These technological breakthroughs have enabled PCB manufacturers to increase their average yield by 18% and reduce rework costs by 37%, bringing revolutionary significance especially to the production of HDI blind and buried via boards and flexible circuit boards.
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